BSPDN Integration Engineer

Job Description

Job Title: BSPDN Integration Engineer. Location: Albany, New York, United States

Responsibilities:

• Lead research and development of back-side power rail distribution for logic applications.
• Conduct 300mm wafer bonding and Cu interconnect process integration;
• Develop and refine lithography alignment strategies for advanced semiconductor manufacturing.
• Oversee Silicon-CMOS (Si-CMOS) integration including Back End of Line (BEOL) and Middle of Line (MOL) contact modules.
• Collaborate with a world-class team to advance quantum hardware and semiconductor technologies;
• Engage with industry partners and clients to push the boundaries of logic technology;
• Work on-site at IBM Research Center in Albany, NY, including some evening/weekend shifts as needed.

Qualifications:

• Bachelor’s degree in Physics, Material Science, Engineering, or related fields.
• At least 8+ years (Bachelor’s), 5+ years (Master’s), or 4+ years (PhD) of experience in Si-CMOS process development.
• Hands-on experience in 300mm semiconductor fabrication;
• Strong expertise in BEOL/MOL process development and heterogeneous integration.
• Knowledge of lithography alignment and semiconductor device integration.

Preferred:

• PhD in a relevant field.
• Experience in high-volume semiconductor manufacturing.
• Prior work in heterogeneous integration and wafer bonding techniques.

Benefits & Perks:

• Healthcare: Medical, dental, vision, and mental health coverage.
• Financial Programs: 401(k), stock purchase plan, financial counseling, life insurance, and performance-based incentives.
• Paid Time Off: 12 holidays, 120 vacation hours, sick leave, and 12 weeks of parental leave;
• Career Development: AI-driven learning platform with industry certifications;
• Work-Life Balance: Employee resource groups, volunteer opportunities, and retail discounts.