Lead Lithography Engineer

Job Description

Job Title: Lead Lithography Engineer. Location: Albany, NY, United States

Responsibilities:

• Lead the research and development of EUV lithography for advanced BEOL (Back-End-Of-Line) technology.
• Develop and refine multi-patterning, pitch scaling, and edge placement error methodologies.
• Guide the selection and development of EUV photoresist, underlayer, and hardmask materials;
• Provide hands-on technical leadership for semiconductor patterning and fabrication teams.
• Utilize CDSEM, stochastics analysis, and large-area inspection techniques for process monitoring.
• Collaborate across departments to define lithography roadmaps and technology strategies.
• Mentor junior engineers and oversee the execution of key workstreams;
• Contribute to intellectual property (patents) and industry publications.
• Engage in occasional travel to Yorktown Heights, NY, and internationally (<10%).

Qualifications:

• Bachelor’s degree in Chemical Engineering, Electrical Engineering, Materials Science, Chemistry, or Physics.
• 8+ years of experience in lithography and BEOL semiconductor processing.
• 5+ years of experience in technical leadership and project management;
• Hands-on experience with CDSEM and large-area inspection techniques.

Preferred:

• MS/PhD in a relevant science or engineering discipline.
• 10+ years of experience in EUV Lithography.
• Expertise in computational lithography (OPC/RET) and test vehicle/mask layout design.

Benefits & Compensation:

• Competitive salary: $157,000 - $237,000 per year.
• Comprehensive healthcare (medical, dental, vision, mental health).
• 401(k), stock purchase plan, financial counseling.
• Paid time off (vacation, sick leave, holidays, parental leave);
• Ongoing training & development through IBM’s AI-driven learning platform.
• Inclusive work environment with employee resource groups and volunteer opportunities.