Semiconductor Packaging Engineer

Job Description

Job Title: Advanced Semiconductor Packaging Engineer. Location: Brooklyn Park, MN

Responsibilities:

• Design and implement advanced packaging strategies for ion trap chips with high I/O density.
• Develop processes that support mechanical, thermal, electrical, optical, and detection needs.
• Collaborate with vendors to validate and scale packaging processes;
• Ensure packaging compatibility across all stages of ion trap development;
• Coordinate with internal teams to meet broader system requirements.
• Build and manage external partnerships and co-development initiatives.

Qualifications:

• Bachelor’s degree in Engineering, Physics, or a related field (required).
• Minimum of 3 years in advanced semiconductor packaging development;
• U.S. Person status (U.S. citizen, permanent resident, or asylee/refugee);
• Not eligible if a PRC or Russian national unless also a U.S. citizen.

Preferred:

• PhD in Physics or Engineering.
• 7+ years of experience in semiconductor packaging.
• Expertise in large-area chips, multi-chip modules, bump bonding, and 2.5D/3D packaging.
• Experience with photonic packaging and fiber-to-chip integration;
• Strong record of innovation and intellectual property generation;
• Comfortable working in cross-functional teams;

Compensation & Benefits:

• Salary: $113,000 – $140,000 annually
• Health, dental, and vision insurance (subsidized)
• Flexible work schedules
• 401(k) plan with match and student loan repayment options
• Paid parental leave;
• 12 paid holidays, vacation, and sick leave;
• Equity opportunities;
• Employee discounts